Test Beam Module Spreadsheet Description


Global ChannelChannel number from 0 to 14*128-1. Global channel 0 is on the phi side, chip 0, channel 0.
ChipChip number from 0 to 13. 0-6 are on the phi side. 7-13 are on the z side (Chip 7 is elctronics address 0 on the z side).
ChannelChannel number from 0-127 on the chip.
SidePhi (n) or Z (p) side of silicon.
Silicon StripStrip number on the silicon. Numbering starts from 1, not 0. On the z side, strips 1-441 are on wafer 1 (wafer closest to HDI) and strips 442-882 are on wafer 2.
DFA FaultCode for the fault type from DFA testing (see below).
BondingCode for wire bonding (see below).
HDI Fault, UnbondedCode for HDI faults found before wirebonding.
HDI Fault, BondedCode for HDI faults found after bonding.
Gains, UnbondedChannel gains in mV/fC measured before bonding to DFA.
Intercepts, UnbondedChannel intercepts in mV measured before bonding to DFA.
Gains, BondedChannel gains in mV/fC measured after bonding to DFA.
Intercepts, BondedChannel gains in mV measured after bonding to DFA.
Noise (counts)Channel noise, measured after bonding, in units of threshold DAC counts.
Noise (electrons)Channel noise, measured after bonding, in units of ENC. This is just Noise(counts)*6250*4.29/(Gain, Bonded)

DFA Fault Codes

2 Short between readout strips
3Short between readout strip and floating strip
4Short to p-stop
5Open on Upilex
6Broken metal on Silicon
666Unknown DFA

Bonding Codes

1No Bond, Silicon-Silicon
2No Bond, Silicon-Upilex
3No Bond, Upilex-HDI
4No Bond, plucked for study after gain and noise measurement

HDI Fault Codes

1Dead Channel
2Noisy Channel
3Inefficient Channel
4Digital Problem(turns on even when masked off)
5Stuck On
777Flaky, unknown problem

For an explanation of how the gains, offsets and noise are measured, see http://www.hep.ucsb.edu/BaBar/gains.html. In the spreadsheet we use channel-by-channel gains rather than an average value.

Note: A problem developed on Chip 6 between the unbonded and bonded tests. It is now effectively dead. Also, the extraction of gains and offset for chips 3 and 11 could be suspect due to intermittent problems. See http://www.hep.ucsb.edu/BaBar/TestBeamHints.html.