RECEIVING DFA’s
- Description:
Receiving DFA's involves the following steps:
- Steps:
IMMEDIATELY UPON RECEIVING:
- Take the DFA out of its shipping box and save all the documentation included.
The documentation includes mailing slips and sometimes Pisa data sheets.
The mailing information goes in top filing cabinet drawer and the Pisa data sheets go into the part's binder.
- Organize a binder with dividers. Layer 1 binders are forest, layer
2 binder are navy, and layer 3 binders are burgundy.
- Inspect shipping fixtures. Make notes of any visual scratches and/or cracks
on traveler.
- Enter the new DFA into the production database.
- If there are no more available right layer/direction ringframes for the DFA, here is some information about what you need to assemble a layer 2 ringframe
Rails: Use 4-40 x 1/4 Socket Head Cap Screws (SCHS)
Plastic Covers: 6-32 x 3/16 Button Head Cap Screws (BHCS)
Black Delron Clamps: 6-32 x 1/4 BHCS that have flat tops
Make sure these clamps are very clean! They hold the DFA in the ringframe, and the clamps sit directly on the wafers!
G-10: 6-32 x 1/4 SHCS;1/8" dowel pins which
hold the G-10 in
the ringframe and 2 mm dowel pins in the G-10 used to position
the upilex.
VISUAL INSPECTION:
- Visually inspect the part; note scratches, marks, and/or excess glue on the upilex and silicon. Write down this information on a survey sheet while surveying the DFA.
- For the Z side: under the high power microscope, the Z-side should be inspected along
the glue line of upilex and Silicon. Also inspect along the opposite edge on
the silicon wafers. If the upilex covers too much of the silicon wafers,
take note on the survey sheet. Inspect along the vertical edge of wafer
2 to note if upilex is over the edge of detectors and if so, how far it is.
- For the Phi side: inspect the butt bond joint of glue and the Upilex
Silicon area
ENTER PISA DATA INTO THE BONDMAP DATABASE:
- If fault data from Pisa is available, enter it into the bondmap database.
3. People to ask if problems
arise: