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DFA Production Status at UCSB

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D02B.10

8/21/97

Yes

Yes

Ready for HDI

D02B.11

8/21/97

Yes

Yes

Ready for HDI

D02B.12

4/9/98

Yes

Yes

Ready for HDI

Both wafers rotated by

pi; z side tests

humidity-sensitive

D02B.13

4/9/98

Yes

Yes

Ready for HDI

Very high burn-in

currents (total current

reached the power

supply limit of ~220

D02B.15

9/23/98

No

No

Both Z and Phi side completely bonded;

Operating voltage is

testing/rework being performed

only a guess -- no info

from Pisa available yet.

Layer:

3

Part:

Received:

Bonded:

Tested:

Current Status:

Special Comments:

D03F.03

1/12/98

Yes

Yes

Ready for HDI

D03F.04

1/12/98

Yes

Yes

Ready for HDI

D03F.05

1/12/98

Yes

Yes

Ready for HDI

D03F.06

4/22/98

Yes

Yes

Ready for HDI

D03F.07

4/22/98

Yes

Yes

Final tests being performed

D03F.08

4/22/98

Yes

Yes

Ready for HDI

D03F.09

4/22/98

Yes

Yes

Final tests being performed

D03B.05

1/12/98

Yes

Yes

Ready for HDI

D03B.06

1/12/98

Yes

No

Both Z and Phi side completely bonded

Julie considers this a

type B due to fragile

long U-Si bonds.

D03B.07

4/22/98

Yes

Yes

Ready for HDI

Many opens on upilex

1234<N<1265 due to

scratch near tree 10.

D03B.08

4/9/98

Yes

Yes

Ready for HDI

D03B.10

4/22/98

Yes

Yes

Final tests being performed

wafer 2 rotated by pi

D03B.11

5/12/98

Yes

No

Both Z and Phi side completely bonded;

Has drawn high

testing/rework being performed

current (up to 40 uA);

settles to 14 uA after

D03B.12

5/12/98

Yes

Yes

Ready for HDI

5 p-stop shorts

appeared during

preliminary burn-in

Class

B

DFA's:

Layer:

1

Part:

Received:

Bonded:

Tested:

Current Status:

Special Comments:

D01F.02

10/8/97

Yes

Yes

Ready for HDI

D01B.03

10/8/97

Yes

No

Both Z and Phi side completely bonded;

testing/rework being performed

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